IN-MOULD STRCTURAL ELECTRONICS (IMSE)

In-Mould Structural Electronics (IMSE) technology integrates a pre-printed electronic circuit film through overmolding, in collaboration with TACTOTEK. This solution offers exceptional versatility and design freedom, making it ideal for applications such as vehicle interior consoles, displays, and more. It incorporates intelligent flexible sensors and components for industrial and IoT (Internet of Things) applications.

ADVANTAGES

· Weight reduction of up to 70% by replacing rigid electronic components.

· Cost savings through the minimization of assembly processes.

· Greater design flexibility, allowing free placement of connectors and cables, as well as the integration of capacitive buttons.